Diameter [mm] | Weight [g/m] | Length [m] |
---|---|---|
3 | 6 | 200 |
4 | 9 | 200 |
5 | 12 | 200 |
6 | 15 | 200 |
8 | 24 | 100 |
10 | 33 | 100 |
12 | 58 | 50 |
15 | 100 | 50 |
18 | 150 | 50 |
20 | 175 | 50 |
25 | 230 | 50 |
30 | 310 | 25 |
35 | 480 | 20 |
40 | 665 | 20 |
50 | 880 | 15 |
Description | Flexible, cold-formable laminate made of fine mica (phlogopit) and magnesia-silicate fiber with a special binder, free of asbestos, tearproof |
Raw materials | Phlogopit, magnesia-silicate fiber, glass fiber |
Binding | Silicon resin |
Thickness | 2.4 mm |
Max. temperature for use | 1,200 °C |
Processing | by bonding |
Heat conductivity W/mK | 0.13 at 500°C; 0.21 at 1,000°C |
Dielectric strength | 6 KV/mm Mica (due to IEC 243 at 20°C) |
Tracking resistance | Grade KA 3c (VDE 0303/1) |
Due to GefStoffV and EG directives | Sanitary harmless material! |
Warehousing | dry |
Packaging in coils | Width 1,000 mm |
Length 25,000 mm |
Description | Flexible, cold-formable laminate made of fine mica (phlogopit) and magnesia-silicate fiber with a special binder, free of asbestos, tearproof |
Raw materials | Phlogopit, magnesia-silicate fiber, glass fiber |
Binding | Silicon resin |
Thickness | 2.3 mm |
Max. temperature for use | 1,100 °C |
Processing | by bonding |
Heat conductivity W/mK | 0.1 at 400°C |
Dielectric strength | 23 KV/mm Mica (due to IEC 243 at 20°C) |
Tracking resistance | Grade KA 3c (VDE 0303/1) |
Due to GefStoffV and EG directives | Sanitary harmless material! |
Warehousing | dry |
Packaging in coils | Width 1,000 mm |
Length 25,000 mm |
Description | Cold-formable insulating material with high elasticity and mechanical stability, glass fiber reinforced, tearproof |
Raw materials | Phlogopit-mica, glass fabric |
Binding | Silicon resin |
Thickness | 0.41 ± 0.05 mm |
Max. temperature for use | 1,200 °C |
Processing | by bonding |
Heat conductivity W/mK | 0.20 at 200°C |
0.35 at 400°C | |
Dielectric strength | 23 KV/mm Mica (due to IEC 243 at 20°C) |
Tracking resistance | Grade KA 3c (VDE 0303/1) |
Warehousing | dry |
Packaging in coils | Width 1,000 mm |
Length 25,000 mm |
Description | mica paper, reinforced on both sides with glass fibers |
Raw materials | Phlogopit-mica |
Binding | Silicon resin |
Thickness | 0.4 mm |
Max. temperature for use | 1,200 °C |
Processing | by bonding |
Heat conductivity W/mK | 0.2 at room temperature |
Dielectric strength | > 3 KV/mm (due to IEC 243 at 20°C) |
Tracking resistance | Grade KA 3c (VDE 0303/1) |
Warehousing | dry |
Packaging in coils | Width 1,000 mm |
Length 25,000 mm |