Sealing cords and insulation materials

Abdichtschnure
Diameter [mm]Weight [g/m]Length [m]
36200
49200
512200
615200
824100
1033100
125850
1510050
1815050
2017550
2523050
3031025
3548020
4066520
5088015


Insulation materials


Insulation materials

Dorit-insolation combination EL 1200-25

DescriptionFlexible, cold-formable laminate made of fine mica (phlogopit) and magnesia-silicate fiber with a special binder, free of asbestos, tearproof
Raw materialsPhlogopit, magnesia-silicate fiber, glass fiber
BindingSilicon resin
Thickness2.4 mm
Max. temperature for use1,200 °C
Processingby bonding
Heat conductivity W/mK0.13 at 500°C; 0.21 at 1,000°C
Dielectric strength6 KV/mm Mica (due to IEC 243 at 20°C)
Tracking resistanceGrade KA 3c (VDE 0303/1)
Due to GefStoffV and EG directivesSanitary harmless material!
Warehousingdry
Packaging in coilsWidth 1,000 mm
Length 25,000 mm



Dorit-insolation combination BA 25/100

DescriptionFlexible, cold-formable laminate made of fine mica (phlogopit) and magnesia-silicate fiber with a special binder, free of asbestos, tearproof
Raw materialsPhlogopit, magnesia-silicate fiber, glass fiber
BindingSilicon resin
Thickness2.3 mm
Max. temperature for use1,100 °C
Processingby bonding
Heat conductivity W/mK0.1 at 400°C
Dielectric strength23 KV/mm Mica (due to IEC 243 at 20°C)
Tracking resistanceGrade KA 3c (VDE 0303/1)
Due to GefStoffV and EG directivesSanitary harmless material!
Warehousingdry
Packaging in coilsWidth 1,000 mm
Length 25,000 mm



Dorit Mica SW 0041

DescriptionCold-formable insulating material with high elasticity and mechanical stability, glass fiber reinforced, tearproof
Raw materialsPhlogopit-mica, glass fabric
BindingSilicon resin
Thickness0.41 ± 0.05 mm
Max. temperature for use1,200 °C
Processingby bonding
Heat conductivity W/mK0.20 at 200°C
0.35 at 400°C
Dielectric strength23 KV/mm Mica (due to IEC 243 at 20°C)
Tracking resistanceGrade KA 3c (VDE 0303/1)
Warehousingdry
Packaging in coilsWidth 1,000 mm
Length 25,000 mm



Dorit Folie C

Description mica paper, reinforced on both sides with glass fibers
Raw materialsPhlogopit-mica
BindingSilicon resin
Thickness0.4 mm
Max. temperature for use1,200 °C
Processingby bonding
Heat conductivity W/mK0.2 at room temperature
Dielectric strength> 3 KV/mm (due to IEC 243 at 20°C)
Tracking resistanceGrade KA 3c (VDE 0303/1)
Warehousingdry
Packaging in coilsWidth 1,000 mm
Length 25,000 mm